Anisotropic conductive adhesion of microsensors applied in the instance of a low pressure sensor

An assembly technology that has received little attention up to now in the area of microsensors is anisotropic conductive sticking, which is already state-of-the-art in the bonding of LCD displays. This procedure was investigated for a microsensors’ application and used for a low pressure sensor as...

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Bibliographic Details
Published in:Sensors and actuators. A, Physical Physical, 2002-04, Vol.97, p.323-328
Main Authors: Briegel, R., Ashauer, M., Ashauer, H., Sandmaier, H., Lang, W.
Format: Article
Language:English
Subjects:
Anisotropic conductive adhesive
Applied sciences
Electronics
Exact sciences and technology
Flip chip
General equipment and techniques
Instruments, apparatus, components and techniques common to several branches of physics and astronomy
Microelectronic fabrication (materials and surfaces technology)
Microsensor assembly
Physics
Pressure sensor
Semiconductor electronics. Microelectronics. Optoelectronics. Solid state devices
Sensors (chemical, optical, electrical, movement, gas, etc.)
remote sensing
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Summary:An assembly technology that has received little attention up to now in the area of microsensors is anisotropic conductive sticking, which is already state-of-the-art in the bonding of LCD displays. This procedure was investigated for a microsensors’ application and used for a low pressure sensor as a practical example. In addition to an improvement in the tolerance to ambient media, the temperature-dependent offset drift could be reduced by a factor of about 10.
ISSN:0924-4247
1873-3069
DOI:10.1016/S0924-4247(01)00845-7