High-resolution shadow-mask patterning in deep holes and its application to an electrical wafer feed-through

The paper presents a technique to pattern materials in deep holes and/or on non-planar substrate surfaces. A rather old technique, namely, electron-beam evaporation of metals through a shadow mask, is used. The realization of high-resolution shadow masks using micromachining techniques is described....

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Bibliographic Details
Published in:Sensors and actuators. A. Physical. 1996-06, Vol.54 (1), p.669-673
Main Authors: Burger, G.J, Smulders, E.J.T, Berenschot, J.W, Lammerink, T.S.J, Fluitman, J.H.J, Imai, S
Format: Article
Language:English
Subjects:
Contacting
Feed-throughs
Micromachining
Patterning
Shadow masks
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Summary:The paper presents a technique to pattern materials in deep holes and/or on non-planar substrate surfaces. A rather old technique, namely, electron-beam evaporation of metals through a shadow mask, is used. The realization of high-resolution shadow masks using micromachining techniques is described. Further, a low ohmic electrical wafer foed-through with a small parasitic capacitance to the substrate and a high placing density is presented.
ISSN:0924-4247
1873-3069
DOI:10.1016/S0924-4247(97)80035-0