Effect of porosity and interface structures on thermal and mechanical properties of SiCp/6061Al composites with high volume fraction of SiC

50 vol.% SiCp/Al composites with high thermal and mechanical properties were successfully produced by spark plasma sintering technique. The influences of sintering temperature on the thermal conductivity, coefficient of thermal expansion and bending strength of the SiCp/Al composites were carefully...

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Bibliographic Details
Published in:Transactions of Nonferrous Metals Society of China 2019-05, Vol.29 (5), p.941-949
Main Authors: HONG, Yu, WANG, Wu-jie, LIU, Jia-qin, TANG, Wen-ming, WU, Yu-cheng
Format: Article
Language:English
Subjects:
mechanical properties
SiCp/6061Al composites
spark plasma sintering
thermal properties
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Summary:50 vol.% SiCp/Al composites with high thermal and mechanical properties were successfully produced by spark plasma sintering technique. The influences of sintering temperature on the thermal conductivity, coefficient of thermal expansion and bending strength of the SiCp/Al composites were carefully investigated. The results show that the SiCp/Al composites sintered at 520 °C exhibits a thermal conductivity of 189 W/(m·K), a coefficient of thermal expansion (50–200 °C) of 10.03×10–6 K–1 and a bending strength of 649 MPa. The high thermal and mechanical properties can be ascribed to the nearly full density and the well interfacial bonding between the alloy matrix and the SiC particles. This work provides a promising pathway for producing materials to meet the needs of high performance electronic packaging.
ISSN:1003-6326
DOI:10.1016/S1003-6326(19)65003-X