Adhesion and fracture of tantalum nitride films

• Published in: Acta materialia 1998-01, Vol.46 (2), p.585-597
• Main Authors: Mody, N.R., Hwang, R.Q., Venka-taraman, S., Angelo, J.E., Norwood, D.P., Gerberich, W.W.
• Format: Article
• Language: English
• Subjects: Condensed matter: structure, mechanical and thermal properties; Exact sciences and technology; Mechanical and acoustical properties; Physical properties of thin films, nonelectronic; Physics; Surfaces and interfaces; thin films and whiskers (structure and nonelectronic properties)
• ISSN: 1359-6454; 1873-2453
• DOI: 10.1016/S1359-6454(97)00243-7

Indentation fracture and continuous nanoscratch testing were used in this study to determine the effects of compressive residual stresses on the fracture of thin sputter-deposited tantalum nitride films. Some films were tested in the as-deposited condition while others were vacuum annealed at 300°C. The only discernible change in structure was a surface rearrangement of atoms into parallel arrays of striations on the vacuum annealed samples revealing a high compressive residual stress state after deposition. Comparison of results and application of mechanics-based models showed that these stresses had a strong effect on the fracture of the as-deposited films. The models also provided a good measure of the residual stress levels and interfacial strain energy release rates.