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Doubleside polishing—a technology mandatory for 300mm wafer manufacturing

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Bibliographic Details
Published in:Materials science in semiconductor processing 2002-08, Vol.5 (4-5), p.375-380
Main Authors: Wenski, G, Altmann, T, Winkler, W, Heier, G, Hölker, G
Format: Article
Language:English
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ISSN:1369-8001
DOI:10.1016/S1369-8001(02)00125-7