Investigation on thermal characterization of low power SMD LED mounted on different substrate packages

•Thermal performance of low power SMD LED mounted on FR4, 2W and 5W aluminum packages was proposed.•LED thermal parameters were determined using thermal transient method via T3ster System.•Simulation using FloEFD software is developed to validate the experiment results.•Structure functions were anal...

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Bibliographic Details
Published in:Applied thermal engineering 2016-05, Vol.101, p.19-29
Main Authors: Raypah, Muna E., M.K., Dheepan, Devarajan, Mutharasu, Sulaiman, Fauziah
Format: Article
Language:English
Subjects:
Junction temperature
Light-emitting diode
Simulation
Surface-Mounted Device (SMD)
Thermal resistance
Thermal transient measurement
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Summary:•Thermal performance of low power SMD LED mounted on FR4, 2W and 5W aluminum packages was proposed.•LED thermal parameters were determined using thermal transient method via T3ster System.•Simulation using FloEFD software is developed to validate the experiment results.•Structure functions were analyzed to determine LED thermal parameters.•Experiment and simulation outcomes demonstrate that 5W aluminum package shows lower thermal resistance and junction temperature. Low power surface-mounted device light emitting diode (SMD LED) is of high interest in research and development due to its portability and miniature size. However, high thermal resistance of low power SMD LED is a major concern due to lack of metal heat spreader. The evaluation of junction temperature and thermal resistance is important in understanding the thermal management and thermal reliability of low power SMD LEDs. In this paper, thermal parameters of low power SMD LED are determined. LED is mounted on different substrate packages which are FR4, 2W and 5W aluminum packages. Thermal parameters of LED are measured using Thermal Transient Tester (T3ster) at 50 and 100 mA. It is found that 5W aluminum package shows lower thermal resistance and junction temperature compared to the other two substrate packages. To validate the experiment, modeling and simulation using FloEFD is developed by considering geometrical model of the substrate packages.
ISSN:1359-4311
DOI:10.1016/j.applthermaleng.2016.02.092