A novel ultra-thin vapor chamber with composite wick for portable electronics cooling

•An ultra-thin vapor chamber is developed with a thickness of only 0.5 mm.•Three kinds of capillary wick structures were prepared and compared.•The composite wick has excellent anti-gravity performance.•The maximum critical power of novel UTVC can be up to 60 W.•The UTVC has great potential for heat...

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Bibliographic Details
Published in:Applied thermal engineering 2023-05, Vol.226, p.120340, Article 120340
Main Authors: Yan, Caiman, Li, Hongming, Tang, Yong, Ding, Xinrui, Yuan, Xuepeng, Liang, Yifu, Zhang, Shiwei
Format: Article
Language:English
Subjects:
Composite wick
Electronic device
Heat dissipation
Ultra-thin vapor chamber
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Summary:•An ultra-thin vapor chamber is developed with a thickness of only 0.5 mm.•Three kinds of capillary wick structures were prepared and compared.•The composite wick has excellent anti-gravity performance.•The maximum critical power of novel UTVC can be up to 60 W.•The UTVC has great potential for heat dissipation in portable electronic devices. With the development of integrated and ultra-thin portable electronics, the ultimate heat dissipation power in extremely narrow spaces (
ISSN:1359-4311
DOI:10.1016/j.applthermaleng.2023.120340