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Double-layer stepped Si(1 0 0) surfaces prepared in As-rich CVD ambience
[Display omitted] •Both (1 × 2) and (2 × 1) reconstructed Si(1 0 0):As surfaces can be prepared by MOCVD.•In situ RAS enables detailed process control even at elevated temperatures.•Si:As surface reactions strongly depend on the Si(1 0 0) substrate misorientation.•Atomically flat low-offcut Si(1 0 0...
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Published in: | Applied surface science 2018-12, Vol.462, p.1002-1007 |
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Main Authors: | , , , , , , , , , |
Format: | Article |
Language: | English |
Subjects: | |
Citations: | Items that this one cites Items that cite this one |
Online Access: | Get full text |
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Summary: | [Display omitted]
•Both (1 × 2) and (2 × 1) reconstructed Si(1 0 0):As surfaces can be prepared by MOCVD.•In situ RAS enables detailed process control even at elevated temperatures.•Si:As surface reactions strongly depend on the Si(1 0 0) substrate misorientation.•Atomically flat low-offcut Si(1 0 0):As-(1 × 2) surfaces with regular double-layer steps.•Arsenic atoms are considered to replace Si atoms during the adsorption process.
Low-defect III-V integration on Si(1 0 0) requires atomically well-ordered heterointerfaces. To this end, we study the interaction of As with Si(1 0 0) surfaces and the formation of dimerized Si(1 0 0):As surfaces in situ with reflection anisotropy spectroscopy during metalorganic chemical vapor deposition (MOCVD). Control of surface processes allows us to intentionally ‘rotate’ the dimer orientation and choose between predominantly (1 × 2) and (2 × 1) reconstructed Si(1 0 0):As surfaces both for low and higher surface misorientation. We also verify that the (2 × 1) surface reconstruction becomes energetically more favorable for vicinal Si(1 0 0):As surfaces. We explain the preparation of Si(1 0 0):As surfaces displaying an almost single-domain, (1 × 2) reconstructed surface with an RMS roughness ≤1 Å and exhibiting broad, atomically flat terraces as well as regular double-layer steps. This surface is highly suitable for subsequent low-defect III-V integration. |
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ISSN: | 0169-4332 1873-5584 |
DOI: | 10.1016/j.apsusc.2018.07.181 |