Flexible NiO nanocrystal-based resistive memory device fabricated by low-temperature solution-process

In this study, a nickel oxide (NiO) nanocrystal (NC) based flexible resistive memory device is demonstrated at temperature as low as 180 °C by ligand exchange process. The fabricated device for flexible application with structure Ni/NiO/Ni on PI substrate exhibits excellent switching characteristics...

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Bibliographic Details
Published in:Current applied physics 2020-02, Vol.20 (2), p.288-292
Main Authors: Yun, Hye-Won, Woo, Ho Kun, Oh, Soong Ju, Hong, Sung-Hoon
Format: Article
Language:English
Subjects:
Flexible ReRAM
Low-temperature process
NiO nanocrystal
Solution-process
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Summary:In this study, a nickel oxide (NiO) nanocrystal (NC) based flexible resistive memory device is demonstrated at temperature as low as 180 °C by ligand exchange process. The fabricated device for flexible application with structure Ni/NiO/Ni on PI substrate exhibits excellent switching characteristics with low set/reset voltages and stable resistance values in both ON and OFF states for over 100 switching cycles of memory operation. Also, this flexible memory device shows stable resistive switching properties under compressive stress with bending radius to 10 mm and consecutive bending cycles. The ReRAM fabricated by a low-temperature solution-process shows potential for next generation flexible electronics. •NiO Nanocrystal based flexible resistive memory device has been fabricated.•By introducing a ligand exchange method, the process temperature was lowered.•The flexible memory shows reliable resistive switching properties under compressive stress and consecutive bending cycles.
ISSN:1567-1739
1878-1675
DOI:10.1016/j.cap.2019.11.019