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Densification of silicon dioxide formed by plasma-enhanced atomic layer deposition on 4H-silicon carbide using argon post-deposition annealing
Post-deposition annealing (PDA) was used to improve gate oxide physical and electrical properties. Deposition was accomplished by plasma-enhanced atomic layer deposition (PEALD). We investigated the densification silicon dioxide (SiO2) formed by PEALD on 4H-silicon carbide (SiC) using PDA without ox...
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Published in: | Ceramics international 2018-08, Vol.44 (12), p.13565-13571 |
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Main Authors: | , , , , , , |
Format: | Article |
Language: | English |
Subjects: | |
Citations: | Items that this one cites Items that cite this one |
Online Access: | Get full text |
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Summary: | Post-deposition annealing (PDA) was used to improve gate oxide physical and electrical properties. Deposition was accomplished by plasma-enhanced atomic layer deposition (PEALD). We investigated the densification silicon dioxide (SiO2) formed by PEALD on 4H-silicon carbide (SiC) using PDA without oxidation and nitridation. PDA was conducted at 400–1200 °C in argon (Ar) ambient. The thickness of the SiO2 was reduced by up to 13.5% after Ar PDA at 1000 °C. As the temperature of the Ar PDA increased, the etching rate of SiO2 decreased. At temperatures greater than 1000 °C, the SiO2 etching rate was low compared with that of thermal SiO2. After PDA, the SiO2/4H-SiC interface was smoother than that of thermal SiO2/4H-SiC. The current density versus oxide field and capacitance versus voltage of the SiO2/4H-SiC metal oxide semiconductor (MOS) capacitors were measured. Sufficient densification of SiO2 formed by PEALD on 4H-SiC was obtained using Ar PDA at 1200 °C. |
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ISSN: | 0272-8842 1873-3956 |
DOI: | 10.1016/j.ceramint.2018.04.190 |