Eco-friendly preparation and characterization of highly thermally conductive polyimide/boron nitride composites

[Display omitted] In this paper, we report the eco-friendly preparation of polyimide/boron nitride (PI/BN) composite sintered materials and the characterization of their thermally conductive properties. First, monomer salt (MS)/BN composite powders were synthesized using a green solvent (water and a...

Full description

Saved in:
Bibliographic Details
Published in:Composites. Part A, Applied science and manufacturing Applied science and manufacturing, 2023-03, Vol.166, p.107396, Article 107396
Main Authors: Jin, Seung-Won, Jin, Yu-Ji, Choi, Yun-Je, Kim, Dam-Bi, Yoon, Kang-Hoon, Kim, Hyun-Woo, Chung, Chan-Moon
Format: Article
Language:English
Subjects:
A. Polymer-matrix composites (PMCs)
B. Thermal properties
E. Compression molding
E. Sintering
Citations: Items that this one cites
Items that cite this one
Online Access:Get full text
Tags: Add Tag
No Tags, Be the first to tag this record!
Description
Summary:[Display omitted] In this paper, we report the eco-friendly preparation of polyimide/boron nitride (PI/BN) composite sintered materials and the characterization of their thermally conductive properties. First, monomer salt (MS)/BN composite powders were synthesized using a green solvent (water and acetone mixture). Next, PI/BN composite powders were synthesized by solvent-free solid-state polymerization (SSP) of MS/BN. Finally, thermally conductive specimens were prepared through solvent-free sintering of PI/BN powders. The PI/BN composite specimens showed high in-plane and out-of-plane thermal conductivities (2.777 and 0.962 W/mK, respectively). Thermal conductivities of the specimens increased 558 % (in-plane) and 483 % (out-of-plane) compared to a pure-PI specimen. We found that ultrasonicated fine BN nanosheets adhered to angular surface of PI particles, leading to effective connections between the BN nanosheets during compression. Our study provides a novel eco-friendly and economical preparation method for highly thermally conductive PI composites.
ISSN:1359-835X
1878-5840
DOI:10.1016/j.compositesa.2022.107396