The electrical conductivity mechanism of Graphene/Copper composite fabricated by one-step pulsed electrodeposition

• Published in: Composites. Part A, Applied science and manufacturing Applied science and manufacturing, 2024-10, Vol.185, p.108345, Article 108345
• Main Authors: Yu, Jiani, Wang, Lidong, Guan, Yekang, Shao, Bin, Zong, Yingying
• Format: Article
• Language: English
• Subjects: A. Graphene; A. Metal-matrix composites (MMCs); B. High-temperature properties; B. Physical properties
• ISSN: 1359-835X
• DOI: 10.1016/j.compositesa.2024.108345

Copper plays a key role in electronics, energy, and so on. However, copper faces the challenge of increasing resistivity with increasing temperature. To overcome this problem, graphene was introduced into copper to prepare graphene/copper (Gr/Cu) composites. Here, we report on the preparation of Gr/Cu-Cu wires and Gr/Cu foil by pulse electrodeposition (P-EP). The electrical conductivity of the Gr/Cu foil was 3.8 % IACS higher than that of pure Cu foil under 180 °C. Graphene plays a crucial role in providing an electron transfer path in the Gr/Cu composite to improve the electrical conductivity under high temperatures. The P-EP process can not only effectively reduce the raw GO, but also introduce nitrogen into graphene which further promotes the transfer of electrons from copper to graphene. These results suggest that Gr/Cu composites have promising prospects for applications at high temperatures and could potentially replace traditional pure Cu.