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Performance of curing epoxy resin as potential anticorrosive coating for carbon steel in 3.5% NaCl medium: Combining experimental and computational approaches

[Display omitted] •TGETET/DAH and TGETET/DDM curing epoxy resins were investigated as potential anticorrosive coatings.•TGETET/DAH and TGETET/DDM tested present higher protective efficiencies (for EIS and PC) compared with 3.5% NaCl solution only.•SEM analysis showed that the TGETET/DAH and TGETET/D...

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Bibliographic Details
Published in:Chemical physics letters 2021-11, Vol.783, p.139081, Article 139081
Main Authors: Hsissou, Rachid, Benhiba, Fouad, Echihi, Siham, Benzidia, Bouchra, Cherrouf, Sghir, Haldhar, Rajesh, Ahmad Alvi, Parvez, Kaya, Savaş, Serdaroğlu, Goncagül, Zarrouk, Abdelkader
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Language:English
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Summary:[Display omitted] •TGETET/DAH and TGETET/DDM curing epoxy resins were investigated as potential anticorrosive coatings.•TGETET/DAH and TGETET/DDM tested present higher protective efficiencies (for EIS and PC) compared with 3.5% NaCl solution only.•SEM analysis showed that the TGETET/DAH and TGETET/DDM could effectively block the Cl- ions attack by chemisorption on the CS surface.•HF, MDs and experimental data lead to used TGETET/DAH and TGETET/DDM as potential anticorrosive coatings for CS in NaCl medium. Triglycidyl ether triethoxy triazine (TGETET) epoxy resin cured by 1.6-diaminohexane (TGETET/DAH) and 4.4-diaminodiphenyl methane (TGETET/DDM) was investigated as potential anticorrosive coating for carbon steel in sodium chloride medium. Polarization curves (PC) and electrochemical impedance spectroscopy (EIS) results displayed the protective efficiency of TGETET/DDM is higher than that of TGETET/DAH in 3.5 %NaCl medium. SEM data showed that both TGETET/DAH and TGETET/DDM could be significantly stopped the chloride ions attack due to adhesion between the protective layer formed on CS coated. Chemical reactivity tendency of TGETET/DAH and TGETET/DDM compounds were evaluated using global quantum chemical descriptors (GQCDs) and molecular dynamics simulation (MDs).
ISSN:0009-2614
1873-4448
DOI:10.1016/j.cplett.2021.139081