Effect of 4-(2-hydroxypropoxy)but-2-yn-1-ol on microstructure and mechanical properties of composite electrodeposited Ni-based ultra-thin diamond dicing blades

• Published in: Diamond and related materials 2023-11, Vol.139, p.110324, Article 110324
• Main Authors: Hong, Qiu, Wang, Siyuan, Zhou, Renchen, Wang, Dingwen, Kang, Ning, Yin, Shaohui
• Format: Article
• Language: English
• Subjects: BMP modification; Diamond dicing blade; Electrodeposition; Molecular dynamics; Ni-diamond composite coatings; Wear resistance
• ISSN: 0925-9635; 1879-0062
• DOI: 10.1016/j.diamond.2023.110324

This study focuses on the preparation of thin dicing blades with commendable mechanical properties, in response to the prevailing trend towards reducing dicing spaces between chips. To enhance the performance of electrodeposited Ni-diamond coating and create Ni-based diamond dicing blades, an organic additive called 4-(2-hydroxypropoxy)but-2-yn-1-ol (BMP) was introduced into a nickel sulfamate solution consisting of 5 μm diamond particles. By optimizing the concentration of BMP, it was observed that the co-deposited diamond particle increased while simultaneously reducing roughness and nickel grain size. The composite coating exhibited a preferred crystal orientation on the (111) plane. The attainment of optimal hardness and wear resistance was achieved with an optimum BMP content of 0.15 g/L. Electrochemical and material calculation analyses unveiled the effective adsorption of BMP on the nickel surface, leading to increased cathodic polarization and a consequent reduction in the electrodeposition rate of nickel ions. During the processing of silicon wafers using a 25 μm thick diamond dicing blade, the measured dicing slot and maximum chipping width were determined as 29.6 μm and 6.2 μm, respectively. The results presented in this study considerably expand the avenues for preparing high-performance diamond dicing blades. [Display omitted] •The optimal hardness and wear resistance of the composite coating is achieved at an optimum content of 0.15 g/L of BMP.•BMP has a higher ability for electron donating and electron accepting than BOZ.•The blade thickness and the width of the dicing slot are 25 μm and 29.6 μm, respectively.•This work provides a new approach to preparing high-performance diamond dicing blades.