A study of localised galvanic replacement of copper and silver films with gold using scanning electrochemical microscopy

Galvanic replacement represents a highly significant process for the fabrication of bimetallic materials, but to date its application has been limited to either modification of large area metal surfaces or nanoparticles in solution. Here, the localised surface modification of copper and silver subst...

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Bibliographic Details
Published in:Electrochemistry communications 2010-05, Vol.12 (5), p.611-615
Main Authors: O'Mullane, Anthony P., Ippolito, Samuel J., Bond, Alan M., Bhargava, Suresh K.
Format: Article
Language:English
Subjects:
Chemistry
Electrochemistry
Electrodeposition
Exact sciences and technology
Galvanic replacement
General and physical chemistry
Microfabrication
SECM
Study of interfaces
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Summary:Galvanic replacement represents a highly significant process for the fabrication of bimetallic materials, but to date its application has been limited to either modification of large area metal surfaces or nanoparticles in solution. Here, the localised surface modification of copper and silver substrates with gold through the galvanic replacement process is reported. This was achieved by generation of a localised flux of AuCl 4 − ions from a gold ultramicroelectrode tip which interacts with the unbiased substrate of interest. The extent of modification with gold can be controlled through the tip–substrate distance and electrolysis time.
ISSN:1388-2481
1873-1902
DOI:10.1016/j.elecom.2010.02.012