Characterization of film materials in wafer processing technology development by XPS

A brief introduction reviews the changes that have occurred in semiconductor wafer processing, which, coupled with developments in X ray Photoelectron Spectroscopy, XPS, instrumentation, have led to XPS becoming a primary materials analysis tool in this industry. Three specific examples illustrating...

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Bibliographic Details
Published in:Journal of electron spectroscopy and related phenomena 2019-02, Vol.231, p.57-67
Main Authors: Saheli, Ghazal, Liu, Wei, Lazik, Christopher, Uritsky, Yuri, Bevan, Malcolm, Tang, Wei, Ma, Paul, Venkatasubramanian, Eswaranand, Bobek, Sarah, Kulshreshtha, Prashant, Brundle, C.R.
Format: Article
Language:English
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Summary:A brief introduction reviews the changes that have occurred in semiconductor wafer processing, which, coupled with developments in X ray Photoelectron Spectroscopy, XPS, instrumentation, have led to XPS becoming a primary materials analysis tool in this industry. Three specific examples illustrating the use of XPS and Angle resolved XPS, ARXPS, are then presented. These are nitridation processing of high k gate material (HfO2 based); the monitoring of Al content and chemistry in a 10A TiAlN film (a metal gate add on process to high k); and deposition of diamond-like amorphous C films (a candidate for hard mask applications in DRAM, NAND flash, and NOR flash memories).
ISSN:0368-2048
1873-2526
DOI:10.1016/j.elspec.2018.03.007