Transient responses of curved array flexible electronic components by finite element analysis

• Published in: Extreme Mechanics Letters 2024-05, Vol.68, p.102153, Article 102153
• Main Authors: Yang, Wencheng, Bian, Chunyan, Kong, Zhiming, Miao, Fuxing
• Format: Article
• Language: English
• Subjects: Array order; Curved array flexible electronic component; Finite element analysis; Impact loading; Transient responses
• ISSN: 2352-4316; 2352-4316
• DOI: 10.1016/j.eml.2024.102153

This article established a finite element analysis model for the transient responses of the curved array flexible electronic component, analyzed the influence on the order of the silicon wafer array of the functional layer on the transient responses of the curved array flexible electronic component. It also analyzed comparatively the differences on displacement, velocity, acceleration of the encapsulation, substrate and functional silicon layers under impact loading. The displacement, velocity and acceleration response amplitude of each layer is affected by the order of the array of functional silicon layers for the arrays with fewer orders. For example, the encapsulation and the substrate layers have better cushioning and energy-absorbing properties in planar flexible components, which can protect the functional silicon layer to damage under impact loading.