Measurement Setup for Identifying Parameters of the Encapsulated Bond Wires

This short paper describes the experimental measurement setup for extraction of dynamical parameters of the encapsulated bond wires. Based on the proposed method a current carrying capability as well as fatigue process can be quantified and statistically evaluated. The integrated circuits with bondi...

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Bibliographic Details
Main Authors: Petrzela, J., Sotner, R., Gotthans, T., Drinovsky, J., Kratochvil, T., Wieers, A.
Format: Conference Proceeding
Language:English
Subjects:
Electronic system
power supplies
precision measurement
switching networks
Citations: Items that this one cites
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Summary:This short paper describes the experimental measurement setup for extraction of dynamical parameters of the encapsulated bond wires. Based on the proposed method a current carrying capability as well as fatigue process can be quantified and statistically evaluated. The integrated circuits with bonding wires and Kelvin probes were fabricated by ON Semiconductor Company in Belgium.
ISSN:2405-8963
2405-8963
DOI:10.1016/j.ifacol.2015.05.146