A review of thermal performance of 3D stacked chips

• Published in: International journal of heat and mass transfer 2024-12, Vol.235, p.126212, Article 126212
• Main Authors: Wang, Zhiqiang, Dong, Rui, Ye, Rihong, Singh, Salvinder Singh Karam, Wu, Shaofeng, Chen, Chenxu
• Format: Article
• Language: English
• Subjects: Thermal analysis; Thermal influencing factors; Thermal performance improvement; Three-dimensional integrated circuits (3-D ICs)
• ISSN: 0017-9310
• DOI: 10.1016/j.ijheatmasstransfer.2024.126212

•Investigate the heat transfer mechanism and the effect of many factors on the thermal performance enhancement by 3D stacked chips.•Methods for improving the thermal performance of 3D stacked chips are discussed.•Put forward some future prospects on the thermal performance enhancement by 3D stacked chips. The technology of three-dimensional integrated circuits (3D ICs) has the potential to diminish the size of packages, decrease interconnect delays, lower energy usage, and enhance overall efficiency. Yet, the problem of heat dissipation in chips caused by the vertical integration method in 3D ICs is particularly evident. In this regard, this paper summarizes the main factors affecting chip heat dissipation and main research directions of heat dissipation performance improvement. Although these methods exhibit strong abilities to dissipate heat, it's also crucial to take into account the complexities of the technology, cost, and other factors. The discussion focuses on enhancing the heat efficiency of 3D stacked chips through the introduction of innovative heat transfer methods, including dual-phase flow heat transfer technology and novel thermal materials.