Study of electromigration resistance of (Pd,Ni)Sn4 phase in lead-free solder joints

A Pd layer is frequently deposited on a Ni substrate as a surface finish in electronic packaging. During soldering process, the (Pd,Ni)Sn4 phase is formed at the solder/Ni interface and it is able to reduce electromigration damage. In this study, various interfacial structures, Sn/Pd(1 or 3 μm)/Ni a...

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Bibliographic Details
Published in:Journal of alloys and compounds 2016-01, Vol.654, p.546-553
Main Authors: Wang, Chao-hong, Li, Kuan-ting
Format: Article
Language:English
Subjects:
Electromigration
Interface
Intermetallics
Lead-free solders
PdSn4
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Summary:A Pd layer is frequently deposited on a Ni substrate as a surface finish in electronic packaging. During soldering process, the (Pd,Ni)Sn4 phase is formed at the solder/Ni interface and it is able to reduce electromigration damage. In this study, various interfacial structures, Sn/Pd(1 or 3 μm)/Ni and Sn/Cu(3 μm)/Pd(1 μm)/Ni, were designed to conduct electromigration tests. The results revealed that the electromigration resistance of the (Pd,Ni)Sn4 was closely associated with the Ni content. In the Sn/Pd(1 or 3 μm)/Ni couple, the (Pd,Ni)Sn4 layer with a high Ni solubility of ∼17 at% cannot retard electromigration. The (Pd,Ni)Sn4 phase was massively migrated into the solder matrix and the Ni substrate was considerably consumed. In the Sn/Cu(3 μm)/Pd(1 μm)/Ni couple, the formed (Pd,Ni)Sn4 layer with a low Ni content (
ISSN:0925-8388
1873-4669
DOI:10.1016/j.jallcom.2015.09.132