Effect of Cu element addition on the interfacial behavior and mechanical properties of Sn9Zn-1Al2O3 soldering 6061 aluminum alloys: First-principle calculations and experimental research

In this study, Sn9Zn-1Al2O3-xCu (x = 0, 1.5, 4.5, 6 wt %) composite solder is used to investigate the effect of Cu element and Al2O3 particles addition in soldering 6061 aluminum alloys. First-principle calculations were performed to explore the interface structure, interfacial energy, contact angle...

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Bibliographic Details
Published in:Journal of alloys and compounds 2018-10, Vol.765, p.128-139
Main Authors: Lu, Yu, Ma, Le, Li, Shu-yong, Zuo, Wei, Ji, Zhi-qiang, Ding, Min
Format: Article
Language:English
Subjects:
Al2O3/Sn9Zn-Cu interface
First-principles
Low temperature wetting
Sn9Zn composite solder
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Summary:In this study, Sn9Zn-1Al2O3-xCu (x = 0, 1.5, 4.5, 6 wt %) composite solder is used to investigate the effect of Cu element and Al2O3 particles addition in soldering 6061 aluminum alloys. First-principle calculations were performed to explore the interface structure, interfacial energy, contact angle, and electronic properties of the Al2O3/Sn9Zn interface. Wettability, microstructure, interface morphology, hardness and mechanical properties of Sn9Zn-1Al2O3-xCu soldering 6061 aluminum alloys were examined in experimental section. In the calculation part, Sn9Zn-1Al2O3-4.5Cu and Sn9Zn-1Al2O3-6Cu show stable structures. For experiments, when the content of Cu element is 4.5%, a large amount of fine Cu5Zn8 phases appear in the soldering seam, and the Al4Cu3Zn solid solution layer is the thinnest and flattest. Meanwhile, using Sn9Zn-1Al2O3-4.5Cu solder, the wetting area and shear strength are increased by 27.12% and 75.6% respectively compared with the original Sn9Zn-1Al2O3 solder, which was attributed to a second phase of Cu5Zn8 strengthening mechanism. The Cu5Zn8 phases can generate obstacle for the dislocation at the grain boundary. •The preparation of composite solders by rapid solidification method is feasible.•The interface structure with 4.5% Cu addition reaches a low interfacial energy value.•Adding 4.5%Cu element can dramatically arise wetting area and strength.•Strengthening mechanism is on account of the particle pinning effect and the appearance of enhanced phase Cu5Zn8.
ISSN:0925-8388
1873-4669
DOI:10.1016/j.jallcom.2018.06.178