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Rapidly achieving a reliable full-ceramic interface of ZrC-SiC composite using Ti interlayer via pulsed electric current joining

A reliable full-ceramic interface of ZrC-SiC composite was achieved rapidly at low temperature via pulsed electric current joining. Using a Ti foil as joining interlayer, the Zr and Si atoms reacted with Ti to form Ti3Zr3Si3, while the dissolved C precipitated in form of TiC. The current delivering...

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Published in:Journal of the European Ceramic Society 2023-05, Vol.43 (5), p.1777-1789
Main Authors: Lin, Jincheng, Zhou, Jiafeng, Zhang, Shuye, Lu, Fugang, Zhao, Jiaqi, Pan, Yucheng, Huang, Yongde, Lin, Panpan, He, Peng, Lin, Tiesong, Zhuang, Yanli
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Language:English
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Summary:A reliable full-ceramic interface of ZrC-SiC composite was achieved rapidly at low temperature via pulsed electric current joining. Using a Ti foil as joining interlayer, the Zr and Si atoms reacted with Ti to form Ti3Zr3Si3, while the dissolved C precipitated in form of TiC. The current delivering during joining promoted the atomic diffusion and caused the preferential growth of TiC, rapidly achieving a full-ceramic interface at 1300 ℃. Evaluating the reliability by Weibull distribution, the full-ceramic interface exhibited a considerable characteristic strength of 178 MPa, and its reliability was better than the raw ZrC-SiC composite. The in-situ formed ceramic interface toughened the joint via the mechanism of multi-cracking, crack deflection and termination. The proposed method provides a practical technology for the rapid joining of ultra-high temperature composites or the construction of layered composites with high toughness at low temperature. •A full-ceramic interface of ZrC-SiC composite was achieved rapidly using Ti interlayer.•The full-ceramic interface exhibited a better reliability than the raw composites.•Pulsed electric current promoted the atomic diffusion and induced preferential growth of TiC.•The toughening mechanism for various interface was revealed.
ISSN:0955-2219
1873-619X
DOI:10.1016/j.jeurceramsoc.2022.12.048