Ice-templated assembly strategy to construct oriented porous Ti3SiC2 ceramics for thermal management and electromagnetic interference shielding in harsh thermal environments

• Published in: Journal of the European Ceramic Society 2023-07, Vol.43 (8), p.3112-3121
• Main Authors: Yang, Feng, Yao, Junru, Du, Wenbo, Huyan, Wenjun, Peng, Guiyu, Zhou, Jintang, Yao, Zhengjun
• Format: Article
• Language: English
• Subjects: Electromagnetic interference shielding; Harsh thermal environment; Ordered porous structure; Thermal conductivity; Ti3SiC2
• ISSN: 0955-2219; 1873-619X
• DOI: 10.1016/j.jeurceramsoc.2023.01.064

Given the electromagnetic interference (EMI) and heat aggregation issue faced by electronic components, an urgent need exists to integrate EMI shielding and thermal conductivity in one material. Herein, a novel lightweight porous Ti3SiC2 ceramic with ordered structural arrangement was fabricated by using budget-friendly raw materials through ice template design and in-situ reaction synthesis. Leveraging the excellent conductivity and thermal conductivity of Ti3SiC2, a dual-functional advanced material with efficient EMI shielding and thermal management capabilities was obtained. At room temperature, porous Ti3SiC2 ceramics can achieve a shielding effectiveness of 35.44 dB and a thermal conductivity of 12.17 W/mK, with performance that can be tuned by porosity. In further, the porous Ti3SiC2 ceramic can work stably in thermal environments from room temperature to 700 °C or in corrosive environments rich in acid, alkali, and salts due to its excellent high temperature oxidation resistance and corrosion resistance. In view of the dual-functional characteristics and the stability of operation in harsh thermal environments, ordered porous Ti3SiC2 ceramics are promising for modern maritime and aerospace applications. •Oriented lightweight porous Ti3SiC2 ceramics were constructed.•Tunable performances can be accomplished by adjusting the porosity.•Stable electromagnetic interference shielding and thermal conductivity in harsh thermal environments.•This work is valuable for applications in equipments used in complex thermal environments.