Copper-nickel functionally magnetic gradient material fabricated via directed energy deposition

• Published in: Journal of manufacturing processes 2023-08, Vol.100, p.47-54
• Main Authors: Grandhi, Manikanta, Nguyen, Vy, Liu, Zhichao, Romo-De-La-cruz, Cesar-Octavio, Song, Xueyan
• Format: Article
• Language: English
• Subjects: Conductivity; Directed energy deposition (DED); Functionally gradient material (FGM); Microstructure
• ISSN: 1526-6125; 2212-4616
• DOI: 10.1016/j.jmapro.2023.05.014

In this paper, a functional gradient material (FGM) of CuSn10 and Inconel 718 is fabricated through a laser-based directed energy deposition (DED) additive manufacturing process. Experimental studies are performed to examine the microstructures, the interface bonding behaviors, and the physical and mechanical properties of the resulting FGMs. The result shows that a sound metallurgical bonding was formed at the interface section. The electrical resistivity for CuSn10, IN718, and CuSn10 – IN718 samples are tested for a temperature range of 320 to 390 K, CuSn10 – IN718 specimen displayed its value in the middle range of its counterparts. The CuSn10 – IN718 FGM displayed the highest absolute Seebeck coefficient in the temperature range 320 K to 390 K. The change in the Seebeck coefficient of the FGM showed a 70 % increase from the single material specimens. This boost indicated a reduction in carrier density across the interface, theorized to be influenced by the interface of the FGM. During the compression strength test, a folding deformation occurred in the copper alloy region but neither buckling nor deformation was triggered at the interface section.