Application of surface tension in the design of novel Sn-Ag-Cu-based solders

• Published in: Journal of non-crystalline solids 2022-04, Vol.582, p.121444, Article 121444
• Main Authors: Hou, Dexiang, Cai, Pengcheng, Luan, Jun, Yu, Zhigang, Zhang, Jieyu, Chou, Kuo-Chih
• Format: Article
• Language: English
• Subjects: Model prediction; Pb-free solders; SAC-based alloys; Surface tension
• ISSN: 0022-3093; 1873-4812
• DOI: 10.1016/j.jnoncrysol.2022.121444

•Surface tension of SAC-based alloys was investigated by various models.•“Binary Exp. +GSM” method agrees best with the experimental data.•“Binary Butler +GSM” method is used in the design of SAC305-based solders. Surface tension is closely related to the wettability of solders, which is a crucial property for the design of Pb-free solders. However, the experimental surface tension data are scarce, especially for the multicomponent systems. In this paper, the surface tension of Sn-Ag-Cu (SAC) based ternary, quaternary and quinary alloys are predicted by various models and verified by experimental data. The calculated results by General Solution model (GSM) combined with binary experimental data are in best agreements with experimental values for most systems. For the systems without enough binary experimental data, GSM model combined with binary Butler equation can also achieve reliable results, which has been applied for predicting the surface tension of SAC305-based quaternary and quinary alloys to guide the design of novel Pb-free solders.