Experimental and numerical analysis of novel adhesive-free structural floor panels (TTP) manufactured from timber-to-timber joints

• Published in: Journal of Building Engineering 2021-03, Vol.35, p.102065, Article 102065
• Main Authors: Baño, Vanesa, Moltini, Gonzalo
• Format: Article
• Language: English
• Subjects: Adhesive-free; Design method; Dovetail connections; Experimental tests; FEM modelling; Slip modulus; Timber floor panels; Timber structures
• ISSN: 2352-7102; 2352-7102
• DOI: 10.1016/j.jobe.2020.102065

The objective of this study is to evaluate the structural behaviour of novel timber-to-timber panels (TTPs), which are free of adhesives or steel connectors, to be used in floors. Experimental bending tests were performed, and deflections and failure loads were obtained, showing a dependence on the separation and height of the connectors. A numerical model was developed to simulate the experimental tests, considering the timber as an orthotropic and bi-modulus material and using the Tsai-Hill failure criterion to predict the ultimate failure load. The model was experimentally validated, obtaining relative differences lower than 9.5% and 8.8% for effective stiffness and failure load, respectively. Since the deflection in serviceability limit states defines the design of the TTPs, a simple design method is proposed. •Novel timber-to-timber panels (TTPs), which are free of adhesives and steel connectors, have been designed to be used as structural floors.•TTPs were manufactured by two timber layers connected through wood dovetail battens and tested in bending to obtain the structural properties.•A numerical model simulating TTPs in bending was developed and validated from experimental tests.•Numerical results were used to propose an equation predicting the slip modulus (K) of the panels.•Diagrams for simple-structural-pre design in serviceability limit state.