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Enhancing the electrical and thermal conductivity of polypropylene composites through the addition of Sb–SnO2/coal gasification fine slag porous microbead powder

Conductive powders comprised of coal gasification fine slag porous microbeads/antimony-doped tin oxide nanoparticles (Sb–SnO2/CM, ATCM) have been prepared via acid leaching and coating. The lowest powder volume resistivity of 2.6 × 103 Ω cm was obtained upon leaching in 20% HCl and coating with a 30...

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Published in:The Journal of physics and chemistry of solids 2022-10, Vol.169, p.110843, Article 110843
Main Authors: Zhang, Jinyi, Zuo, Jing, Xu, Shaonan, Ju, Ankun, Yuan, Wenhua, Zhang, Jiupeng, Wei, Cundi
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Zuo, Jing
Xu, Shaonan
Ju, Ankun
Yuan, Wenhua
Zhang, Jiupeng
Wei, Cundi
description Conductive powders comprised of coal gasification fine slag porous microbeads/antimony-doped tin oxide nanoparticles (Sb–SnO2/CM, ATCM) have been prepared via acid leaching and coating. The lowest powder volume resistivity of 2.6 × 103 Ω cm was obtained upon leaching in 20% HCl and coating with a 30 wt% solution of Sb–SnO2 (pH = 1, Sn/Sb = 6:1). Subsequently, we prepared a 20 wt% ATCM/polypropylene (PP) composite with a volume resistivity of 4.93 × 109 Ω cm, tensile strength of 29.03 MPa, and thermal conductivity of 0.137 W/(m·K), which reached 0.187 W/(m·K) at a 70 wt% loading. When compared with several commercial conductive fillers, such as carbon black, graphene, Sb–SnO2, and Sb–SnO2@TiO2, 20 wt% ATCM/PP has been proven superior or comparable to most of its counterparts in terms of the improved antistatic properties, enhanced thermal conductivity (only lower than Sb–SnO2@TiO2), and mechanical strength (equal to Sb–SnO2). These good performances were found to be derived from the unique ATCM structure with Sb–SnO2 nanoparticles deposited onto the mesopores and surface of CM. This structure prevents the agglomeration of Sb–SnO2 and provides abundant conductive networks. ATCM also shows a decorative light brown color and low cost (15 USD/kg), which are favorable for industrial production. Our results lay a theoretical foundation for the future applications of ATCM. [Display omitted] •The CM porous structure provided more conductive paths and better coating effect.•The structure of surface and pore co-deposition formed a unique conductive network.•PP composite resistivity reached 4.93 × 109 Ω cm with the addition of 20 wt% of ATCM.•Filling 70 wt% of ATCM can increase the thermal conductivity of PP by 1.72 times.•ATCM exhibits significant competitiveness and large-scale production prospects.
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The lowest powder volume resistivity of 2.6 × 103 Ω cm was obtained upon leaching in 20% HCl and coating with a 30 wt% solution of Sb–SnO2 (pH = 1, Sn/Sb = 6:1). Subsequently, we prepared a 20 wt% ATCM/polypropylene (PP) composite with a volume resistivity of 4.93 × 109 Ω cm, tensile strength of 29.03 MPa, and thermal conductivity of 0.137 W/(m·K), which reached 0.187 W/(m·K) at a 70 wt% loading. When compared with several commercial conductive fillers, such as carbon black, graphene, Sb–SnO2, and Sb–SnO2@TiO2, 20 wt% ATCM/PP has been proven superior or comparable to most of its counterparts in terms of the improved antistatic properties, enhanced thermal conductivity (only lower than Sb–SnO2@TiO2), and mechanical strength (equal to Sb–SnO2). These good performances were found to be derived from the unique ATCM structure with Sb–SnO2 nanoparticles deposited onto the mesopores and surface of CM. This structure prevents the agglomeration of Sb–SnO2 and provides abundant conductive networks. ATCM also shows a decorative light brown color and low cost (15 USD/kg), which are favorable for industrial production. Our results lay a theoretical foundation for the future applications of ATCM. [Display omitted] •The CM porous structure provided more conductive paths and better coating effect.•The structure of surface and pore co-deposition formed a unique conductive network.•PP composite resistivity reached 4.93 × 109 Ω cm with the addition of 20 wt% of ATCM.•Filling 70 wt% of ATCM can increase the thermal conductivity of PP by 1.72 times.•ATCM exhibits significant competitiveness and large-scale production prospects.</description><identifier>ISSN: 0022-3697</identifier><identifier>EISSN: 1879-2553</identifier><identifier>DOI: 10.1016/j.jpcs.2022.110843</identifier><language>eng</language><publisher>Elsevier Ltd</publisher><subject>Electrical properties ; Polymers ; Semiconductors ; Thermal conductivity</subject><ispartof>The Journal of physics and chemistry of solids, 2022-10, Vol.169, p.110843, Article 110843</ispartof><rights>2022 Elsevier Ltd</rights><lds50>peer_reviewed</lds50><woscitedreferencessubscribed>false</woscitedreferencessubscribed><citedby>FETCH-LOGICAL-c300t-93dfaf47c1e3a912acd76d52ca002c9f9d843bf3a7b20a8971692b3138f474143</citedby><cites>FETCH-LOGICAL-c300t-93dfaf47c1e3a912acd76d52ca002c9f9d843bf3a7b20a8971692b3138f474143</cites><orcidid>0000-0001-7411-1844</orcidid></display><links><openurl>$$Topenurl_article</openurl><openurlfulltext>$$Topenurlfull_article</openurlfulltext><thumbnail>$$Tsyndetics_thumb_exl</thumbnail><link.rule.ids>314,780,784,27924,27925</link.rule.ids></links><search><creatorcontrib>Zhang, Jinyi</creatorcontrib><creatorcontrib>Zuo, Jing</creatorcontrib><creatorcontrib>Xu, Shaonan</creatorcontrib><creatorcontrib>Ju, Ankun</creatorcontrib><creatorcontrib>Yuan, Wenhua</creatorcontrib><creatorcontrib>Zhang, Jiupeng</creatorcontrib><creatorcontrib>Wei, Cundi</creatorcontrib><title>Enhancing the electrical and thermal conductivity of polypropylene composites through the addition of Sb–SnO2/coal gasification fine slag porous microbead powder</title><title>The Journal of physics and chemistry of solids</title><description>Conductive powders comprised of coal gasification fine slag porous microbeads/antimony-doped tin oxide nanoparticles (Sb–SnO2/CM, ATCM) have been prepared via acid leaching and coating. 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This structure prevents the agglomeration of Sb–SnO2 and provides abundant conductive networks. ATCM also shows a decorative light brown color and low cost (15 USD/kg), which are favorable for industrial production. Our results lay a theoretical foundation for the future applications of ATCM. 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The lowest powder volume resistivity of 2.6 × 103 Ω cm was obtained upon leaching in 20% HCl and coating with a 30 wt% solution of Sb–SnO2 (pH = 1, Sn/Sb = 6:1). Subsequently, we prepared a 20 wt% ATCM/polypropylene (PP) composite with a volume resistivity of 4.93 × 109 Ω cm, tensile strength of 29.03 MPa, and thermal conductivity of 0.137 W/(m·K), which reached 0.187 W/(m·K) at a 70 wt% loading. When compared with several commercial conductive fillers, such as carbon black, graphene, Sb–SnO2, and Sb–SnO2@TiO2, 20 wt% ATCM/PP has been proven superior or comparable to most of its counterparts in terms of the improved antistatic properties, enhanced thermal conductivity (only lower than Sb–SnO2@TiO2), and mechanical strength (equal to Sb–SnO2). These good performances were found to be derived from the unique ATCM structure with Sb–SnO2 nanoparticles deposited onto the mesopores and surface of CM. This structure prevents the agglomeration of Sb–SnO2 and provides abundant conductive networks. ATCM also shows a decorative light brown color and low cost (15 USD/kg), which are favorable for industrial production. Our results lay a theoretical foundation for the future applications of ATCM. [Display omitted] •The CM porous structure provided more conductive paths and better coating effect.•The structure of surface and pore co-deposition formed a unique conductive network.•PP composite resistivity reached 4.93 × 109 Ω cm with the addition of 20 wt% of ATCM.•Filling 70 wt% of ATCM can increase the thermal conductivity of PP by 1.72 times.•ATCM exhibits significant competitiveness and large-scale production prospects.</abstract><pub>Elsevier Ltd</pub><doi>10.1016/j.jpcs.2022.110843</doi><orcidid>https://orcid.org/0000-0001-7411-1844</orcidid></addata></record>
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Polymers
Semiconductors
Thermal conductivity
title Enhancing the electrical and thermal conductivity of polypropylene composites through the addition of Sb–SnO2/coal gasification fine slag porous microbead powder
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