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Effects of pH on inhibitor-doped hybrid protective sol–gel coatings on the copper electrode surface

•AHMTa/hybrid sol–gel matrix prepared and coated over Cu metal by Self-assembled monolayer method (SAMs).•Surface morphological analysis provided strong evidence for the existence of adherent coating over Cu metal at pH-4.•AHMTa-doped hybrid sol–gel coating at pH-4 shows remarkable anti-corrosion pe...

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Bibliographic Details
Published in:Journal of the Taiwan Institute of Chemical Engineers 2021-02, Vol.119, p.259-268
Main Authors: Balaji, Jaganathan, Oh, Tae Hwan, Sethuraman, Mathur Gopalakrishnan
Format: Article
Language:English
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Summary:•AHMTa/hybrid sol–gel matrix prepared and coated over Cu metal by Self-assembled monolayer method (SAMs).•Surface morphological analysis provided strong evidence for the existence of adherent coating over Cu metal at pH-4.•AHMTa-doped hybrid sol–gel coating at pH-4 shows remarkable anti-corrosion performance over Cu metal.•DFT and MD simulations results are in accordance with the observed inhibition efficiencies. In this study, hybrid inhibitor-doped sol–gels were synthesized using 4-amino-3-hydrazino-5-mercapto-1,2,4-triazole (AHMT), 3-glycidoxypropyltrimethoxysilane (GPTMS), and tetraethoxysilane (TEOS) at different pH values (4, 7, and 11). The fabricated sol–gels were applied as coatings via a self-assembly method to obtain corrosion resistance for copper substrates in 3.5% NaCl. The AHMT-doped hybrid sol–gel coatings were characterized through different methods. Interactions between the hybrid AHMT-doped sol–gel and copper metal were demonstrated by quantum chemical calculations based on the density functional theory and molecular dynamics simulations. The results from electrochemical impedance spectroscopy and potentiodynamic polarization analysis of the hybrid AHMT-doped sol–gel coating at pH 4 demonstrated enhanced corrosion resistance compared to the data from the tests at pH values of 7 and 11. This can be explained by the formation of an effectively packed layer, which acted as a physical barrier against corrosive chloride ions that protected copper metal against corrosion. [Display omitted]
ISSN:1876-1070
1876-1089
DOI:10.1016/j.jtice.2021.02.006