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Ultrasonic-assisted transient liquid phase bonding of SiC ceramic and aluminum alloy using an inactive Zn interlayer

It is very challenging to diffusion-bond ceramic and aluminum alloys using an inactive interlayer. In this work, the joining of SiC ceramic and aluminum alloys was performed by using ultrasonic-assisted transient liquid phase (TLP) bonding with an inactive interlayer of pure Zn. The TLP bonded joint...

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Bibliographic Details
Published in:Materials characterization 2023-06, Vol.200, p.112902, Article 112902
Main Authors: Zhao, Di, Du, Wenkang, Xiu, Ziyang, Yan, Jiuchun
Format: Article
Language:English
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Summary:It is very challenging to diffusion-bond ceramic and aluminum alloys using an inactive interlayer. In this work, the joining of SiC ceramic and aluminum alloys was performed by using ultrasonic-assisted transient liquid phase (TLP) bonding with an inactive interlayer of pure Zn. The TLP bonded joints of SiC/Al are composed of four layers: Zn diffusion, ZnAl eutectic, ZnAl eutectoid, and SiC/bond-metal interfacial layer. With the prolonging of ultrasonic action time, the ZnAl eutectoid layer thickened and ZnAl eutectic layer thinned gradually, and the partial bonding interface of SiC/bond-metal evolved into the full bonding interface. The shear strength and thermal conductivity of the SiC/Al joints increased by the ultrasonic applied within 5 s, depending on the increasing SiC/bond-metal interface bonding ratio. As the ultrasonic acting time is over 5 s, the SiC/Al joints properties increased because of the increasing proportion of ZnAl eutectoid microstructure with better plasticity and lower thermal resistance. It was revealed that the bond metal transformed from an inactive Zn to an active ZnAl alloy with the aid of the dissolution of Al under the action of ultrasounds, and an amorphous Al2O3 transition layer with a thickness of ∼20 nm was formed at the SiC/bond-metal interface. •U-TLP bonding of SiC/Al using the inactive Zn interlayer was successfully performed.•The bond metal transformed from an inactive Zn to an active ZnAl alloy by ultrasound.•Metallurgic bonding between SiC and bond metal was formed by an amorphous Al2O3 layer.•Dissolution and diffusion of Al by ultrasound determined joint formation and property.
ISSN:1044-5803
1873-4189
DOI:10.1016/j.matchar.2023.112902