Cu-W thin film structure influenced by Ar+ energy and beam flow during preparation by ion beam sputtering

•The regulars of ion beam-sputtered Cu-W alloy film structural evolution in different technological parameter was discussed.•Increasing the Ar+’s energy and beam can crystalize the Cu-W film and increase the solid solubility of copper in tungsten.•The Cu-W film deposition rate is mainly influenced b...

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Bibliographic Details
Published in:Materials letters 2017-11, Vol.206, p.172-174
Main Authors: Ai, Yong-ping, Yang, Liu
Format: Article
Language:English
Subjects:
Crystal structure
Sputtering
Thin films
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Summary:•The regulars of ion beam-sputtered Cu-W alloy film structural evolution in different technological parameter was discussed.•Increasing the Ar+’s energy and beam can crystalize the Cu-W film and increase the solid solubility of copper in tungsten.•The Cu-W film deposition rate is mainly influenced by the tungsten target Ar+ beam.•The copper target Ar+ beam has a lesser influence on the film structure. This article focuses on the effects of Ar+ and beam flow on Cu-W film structure produced using dual ion beam sputtering. The testing method is analysis through XRD. The results show that increasing Ar+ energy and beam flow causes the Cu-W film to crystalize. The Cu-W film deposition speed is primarily determined by Ar+ energy and beam flow.
ISSN:0167-577X
1873-4979
DOI:10.1016/j.matlet.2017.07.012