Laser Ultrasonic Thin Film Characterization of Si-Cu-Al-Cu Multi-Layered Stacks

In this work, the step-wise determination of elastic properties of a Si-Cu-Al-Cu stack via laser induced ultrasonic measurements is presented. The analysed Si-Cu-Al-Cu system consists of a silicon (100) substrate, two copper layers and an aluminium layer embedded between the copper layers, with a th...

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Bibliographic Details
Main Authors: Grünwald, Eva, Nuster, Robert, Paltauf, Günther, Maier, Thomas, Wimmer-Teubenbacher, Robert, Konetschnik, Ruth, Kiener, Daniel, Leitgeb, Verena, Köck, Anton, Brunner, Roland
Format: Conference Proceeding
Language:English
Subjects:
Laser Ultrasound
Multi-Layered Systems
Stack Charakterization
Thin Film Characterization
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Summary:In this work, the step-wise determination of elastic properties of a Si-Cu-Al-Cu stack via laser induced ultrasonic measurements is presented. The analysed Si-Cu-Al-Cu system consists of a silicon (100) substrate, two copper layers and an aluminium layer embedded between the copper layers, with a thickness of about 1 µm of each layer. The obtained results for the Young’s moduli and Poisson’s ratios of the multi-layered system are compared to literature values for bulk materials. The presented non-contact method shows high potential regarding the non-destructive evaluation of elastic properties of thin films in multi-layered systems.
ISSN:2214-7853
2214-7853
DOI:10.1016/j.matpr.2017.08.006