An overview on parametric study of photochemical machining process and its applications

Photochemical Machining (PCM) is a well-known tightly controlled selective corrosion technique used to manufacture several micro and nano-size components high in quality and high precision; as it is a non-contact process, it gives a burr-free stress-free surface of the material. Nowadays, PCM is wid...

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Bibliographic Details
Main Authors: Vyas, Jayvardhan, Sawant, Likhit, Tyagi, Shubhang, Joshi, Girish, Deshmukh, Samadhan, Ingle, Asha
Format: Conference Proceeding
Language:English
Subjects:
Magnetic Field Assisted PCM
Material Removal Rate (MRR)
Photochemical Machining (PCM)
Ultrasonic Assisted PCM
Undercut (Uc)
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Summary:Photochemical Machining (PCM) is a well-known tightly controlled selective corrosion technique used to manufacture several micro and nano-size components high in quality and high precision; as it is a non-contact process, it gives a burr-free stress-free surface of the material. Nowadays, PCM is widely used in various industrial applications, including medical and healthcare industries, electronics, precision micro, nano, and other engineering industries. This article describes the correlation between various process parameters like etching temperature, time, and concentration of etchant with some response parameters like surface roughness value, metal removal rate (MRR), undercut (Uc), etch rate. In addition, magnetic field-assisted PCM and ultrasonic-assisted PCM are also explored in detail. The article highlights that etchant concentration and etching time play the most critical role in the PCM process. This article also depicts that with the increase in etchant temperature and etching time, the MRR and undercut increases. The article suggests future scopes and challenges of photochemical machining process.
ISSN:2214-7853
2214-7853
DOI:10.1016/j.matpr.2021.07.093