Analysis of electromigration induced early failures in Cu interconnects for 45nm node

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Bibliographic Details
Published in:Microelectronic engineering 2010-03, Vol.87 (3), p.355-360
Main Authors: Arnaud, L., Cacho, F., Doyen, L., Terrier, F., Galpin, D., Monget, C.
Format: Article
Language:eng ; jpn
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ISSN:0167-9317
DOI:10.1016/j.mee.2009.06.014