Reliable peripheral anchor-assisted transfer printing of ultrathin SiO2 for a transparent and flexible IGZO-based inverter

This study demonstrates the utility of a printable ultrathin silicon dioxide (SiO2) substrate for developing highly transparent and flexible electronic devices. SiO2 provides a wider thermal process window than that of plastics, which is necessary for producing various electronics. To manipulate thi...

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Bibliographic Details
Published in:Microelectronic engineering 2018-10, Vol.197, p.15-22
Main Authors: Yoo, Jung Il, Jang, Hun Soo, Jang, Juhwan, Yoon, Jongwon, Kwon, Oh. Young, Park, Jong Jun, Kang, Sang Myeong, Yoo, Tae Jin, Kim, Seung Hyun, Lee, Byoung Hun, Choa, Sung-Hoon, Ko, Heung Cho
Format: Article
Language:English
Subjects:
Anchor-assisted transfer printing
Flexible inverter
IGZO
SiO2
Transparent electronics
Ultrathin device fabrication
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Summary:This study demonstrates the utility of a printable ultrathin silicon dioxide (SiO2) substrate for developing highly transparent and flexible electronic devices. SiO2 provides a wider thermal process window than that of plastics, which is necessary for producing various electronics. To manipulate this fragile material, we employed a supportive handling substrate and transfer printing process using a sacrificial layer and protruding SU-8 anchors. In particular, we characterized the interfacial stress level and mechanics between the SiO2 substrate and the anchors during the retrieval process. We also manipulated the configuration of the corner of the SiO2 substrate to develop a reliable transfer printing process, which resulted in a high transfer yield with no distortion or fracture of the SiO2 patterns. As an example to demonstrate the utility of this method, we successfully developed a transparent and flexible thin-film inverter based on amorphous indium gallium zinc oxide (IGZO) with an 84.7% average optical transmittance on a polyethylene terephthalate (PET) film with an adhesive layer. Approaches for processing a brittle SiO2 layer in a stable manner allow its feasible use as a transparent flexible electronic device substrate. Introduction of a sacrificial GeOx layer and SU-8 anchors provides both thermally and mechanically secure fabrication as well as printable formats to allow the “stick-and-play” system on a desired surface. [Display omitted] •Fabrication process for an ultrathin SiO2 substrate in a printable format•Stress distribution analysis of ultrathin SiO2 substrate during transfer printing•Realization of transparent and flexible IGZO-based inverter
ISSN:0167-9317
1873-5568
DOI:10.1016/j.mee.2018.05.003