Characterization of phase change material systems using a thermal test device

This work presents a thermal characterization approach for phase change materials thermal management systems (PCM-TMS) based on a thermal test device (TTD) allowing simultaneous dissipation and chip temperature measurement. The tests are oriented towards PCM-TMS characterization for their applicatio...

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Bibliographic Details
Published in:Microelectronics 2015-12, Vol.46 (12), p.1195-1201
Main Authors: Jordà, Xavier, Esarte, Jesús, Perpiñà, Xavier, Vellvehi, Miquel, Argandoña, Gorka, Aresti, Maite
Format: Article
Language:English
Subjects:
Phase change materials
Thermal characterization
Thermal management
Thermal test devices
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Summary:This work presents a thermal characterization approach for phase change materials thermal management systems (PCM-TMS) based on a thermal test device (TTD) allowing simultaneous dissipation and chip temperature measurement. The tests are oriented towards PCM-TMS characterization for their application in the power electronics domain, providing an insight to the physical phenomena involved in PCM systems. The PCM-TMS used in this work consists in a 35mm diameter and 9.5mm height Cu case, containing a 20ppi porous Cu mesh and a 31°C melting temperature paraffin. It has been demonstrated that the proposed characterization methodology is suitable for the assessment of this kind of non-linear systems, allowing an easy acquisition of both, heating and cooling transients.
ISSN:1879-2391
1879-2391
DOI:10.1016/j.mejo.2015.09.022