Electromagnetic modeling and analysis of the tapered differential through glass vias

An analytic model of the tapered differential through glass vias is proposed in this paper. Each expression accounting for the via length, diameter, slope angle and pitch is derived from basic physics and the IMD layer is included, additionally. The RLGC equivalent circuit is verified by comparing t...

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Bibliographic Details
Published in:Microelectronics 2019-01, Vol.83, p.27-31
Main Authors: Liu, Yang, Zhu, Zhangming, Liu, Xiaoxian, Lu, Qijun, Yin, Xiangkun, Guo, Lixin, Yang, Yintang
Format: Article
Language:English
Subjects:
3D ICs
Differential through glass vias
Equivalent-circuit model
Glass interposer
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Summary:An analytic model of the tapered differential through glass vias is proposed in this paper. Each expression accounting for the via length, diameter, slope angle and pitch is derived from basic physics and the IMD layer is included, additionally. The RLGC equivalent circuit is verified by comparing the S-parameters resulted from the 3-D full-wave electromagnetic solver High Frequency Simulator Structure (HFSS) and Advanced Design System (ADS). The feature selective validation (FSV) technique is used to as a measure of the comparisons. The proposed model and HFSS results show accordance with each other up to 20 GHz The excellent transmission characteristics of glass substrate reflect from S-parameters, of which the S21 is about the order of magnitude of 10−3 dB and the S11 is lower than −30 dB till 20 GHz. Moreover, the impact of different configuration on transmission coefficient is investigated.
ISSN:1879-2391
1879-2391
DOI:10.1016/j.mejo.2018.11.005