Phase field study on the effect of roughness on interfacial intermetallic compounds of micro-solder joints under multifield coupling

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Bibliographic Details
Published in:Microelectronics and reliability 2022-10, Vol.137, p.114792, Article 114792
Main Authors: Guo, Hao, Zhang, Long, Yin, Limeng
Format: Article
Language:English
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ISSN:0026-2714
DOI:10.1016/j.microrel.2022.114792