Ruggedized sensor packaging with advanced die attach and encapsulation material for harsh environment

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Bibliographic Details
Published in:Microelectronics and reliability 2023-11, Vol.150, p.115115, Article 115115
Main Authors: Tay, Y.S., Yang, L., Zhang, H., Kor, H.B., Zhang, L., Liu, H., Gill, V., Lambourne, A., Li, K.H.H., Chen, Z., Gan, C.L.
Format: Article
Language:English
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ISSN:0026-2714
DOI:10.1016/j.microrel.2023.115115