Highly reliable micro-scale Cu sintered joint by oxidation-reduction bonding process under thermal cycling

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Bibliographic Details
Published in:Microelectronics and reliability 2023-11, Vol.150, p.115123, Article 115123
Main Authors: Kim, Min-Su, Kim, Dongjin, Roh, Myong-Hoon, Nishikawa, Hiroshi
Format: Article
Language:English
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ISSN:0026-2714
DOI:10.1016/j.microrel.2023.115123