Investigating the solder mask defects impact on leakage current on PCB under condensing humidity conditions

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Bibliographic Details
Published in:Microelectronics and reliability 2023-11, Vol.150, p.115210, Article 115210
Main Authors: Zhang, Kaichen, Bahman, Amir Sajjad, Iannuzzo, Francesco, Chopade, Amol Ramesh, Holst, Jørgen, Rao, Jyothsna Murli, Bahrebar, Sajjad, Ambat, Rajan
Format: Article
Language:English
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ISSN:0026-2714
DOI:10.1016/j.microrel.2023.115210