Evaluation of bonding techniques for ultrasound transducers

Saved in:
Bibliographic Details
Published in:Microelectronics and reliability 2023-12, Vol.151, p.115272, Article 115272
Main Authors: Bolstad, Per Kristian, Frijlink, Martijn, Hoff, Lars
Format: Article
Language:English
Citations: Items that this one cites
Items that cite this one
Online Access:Get full text
Tags: Add Tag
No Tags, Be the first to tag this record!
Description
Summary:
ISSN:0026-2714
DOI:10.1016/j.microrel.2023.115272