Squeeze infiltration processing and characterization of silicon reinforced composites

• Published in: Materials today communications 2022-08, Vol.32, p.103870, Article 103870
• Main Authors: Arsha, A.G., Manoj, Visakh, Akhil, M.G., Anbukkarasi, R., Rajimol, P.R., Rajan, T.P.D.
• Format: Article
• Language: English
• Subjects: A356 alloy; Aluminium; Coefficient of thermal expansion; Silicon; Squeeze Infiltration
• ISSN: 2352-4928; 2352-4928
• DOI: 10.1016/j.mtcomm.2022.103870

Thermal management components such as heat sink and heat spreaders used in electronic systems require materials with low CTE, low density and high thermal conductivity. The present work aims to fabricate a low-cost Si particle reinforced-A356 composite as thermal base plate for thermal management applications. The composites were prepared using squeeze infiltration technique where 30–70%Si preforms are used for reinforcement. The composite with high Si content in Al matrix possesses low density, low coefficient of thermal expansion (CTE) and good thermal conductivity. The density for the 70Si composite is 2.39 gm/cc (density of Al: 2.7 gm/cc) and CTE at room temperature is 10.5 × 10−6 K−1 (CTE of Al: 23 ×10−6 K−1). The increase in Si particle volume percentage in 356 Aluminum alloy matrix has decreased the CTE and density significantly. Effect of the silicon particles on the thermal and mechanical properties are evaluated and optimized. The theoretical and the experimental properties obtained are in close comparison shows the high integrity of the squeeze infiltrated Al-Si composites. The performance of the composite was studied through simulation using ANSYS workbench. [Display omitted]