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New copper(II) 1D polymer containing dimethyl(phenylsulfonyl)amidophosphate: Synthesis, crystal structure and magnetic properties

The reaction of sodium dimethyl(phenylsulfonyl)amidophosphate Na L (H L = C 6H 5S(O) 2NHP(O)(OCH 3) 2) with Cu(NO 3) 2∙6H 2O and o-bpe (1,2-bis(pyridine-2-yl)ethane) in appropriate ratio, leads to the formation of 1D coordination polymer [Cu( L) 2∙ o-bpe] n in good yield. The structural features, as...

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Bibliographic Details
Published in:Polyhedron 2009-05, Vol.28 (7), p.1331-1335
Main Authors: Moroz, Olesia V., Trush, Victor A., Konovalova, Irina S., Shishkin, Oleg V., Moroz, Yurii S., Demeshko, Serhiy, Amirkhanov, Vladimir M.
Format: Article
Language:English
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Summary:The reaction of sodium dimethyl(phenylsulfonyl)amidophosphate Na L (H L = C 6H 5S(O) 2NHP(O)(OCH 3) 2) with Cu(NO 3) 2∙6H 2O and o-bpe (1,2-bis(pyridine-2-yl)ethane) in appropriate ratio, leads to the formation of 1D coordination polymer [Cu( L) 2∙ o-bpe] n in good yield. The structural features, as well as spectroscopic and magnetic properties are reported. The reaction of sodium dimethyl(phenylsulfonyl)amidophosphate Na L (H L = C 6H 5SO 2NHP(O)(OCH 3) 2) with Cu(NO 3) 2 · 6H 2O and o-bpe (1,2-bis(pyridine-2-yl)ethane) in appropriate ratios, afford the formation of 1D coordination polymer [Cu( L) 2 · o-bpe] n in good yield. The crystal structures of H L ( 1) and [Cu( L) 2 · o-bpe] n ( 2) are reported. In the crystal package the molecules of 1 are linked by intermolecular hydrogen bonds formed by the phosphoryl oxygen atoms which serve as acceptors and nitrogen atoms of amide groups as donors. The crystal structure of 2 indicates the presence of unsaturated Cu( L) 2 unit bridged by o- bpe ligand in the one-dimensional polymeric chain. The Cu(II) atoms have distorted 4 + 2 octahedral CuO 4N 2 environment formed by the oxygen atoms belonging to the sulfonyl and phosphoryl groups of two deprotonated chelate ligands and nitrogen atoms of the bridging o-bpe ligands. The magnetic study of 2 has revealed the presence of a weak intrachain antiferromagnetic exchange interaction between copper ions.
ISSN:0277-5387
DOI:10.1016/j.poly.2009.02.012