Synthesis of transparent and thermally stable polyimide-aramid nanocomposites – Prospective materials for high-temperature electronic manufacture applications

Herein we report a method that improves the optical properties of polyimide-aramid (PIA) by the addition of a large quantity of silica. High silica loading was successful due to the good compatibility of synthesized unique silane end-capped polyimide-aramid (PIA) with in-situ formed silica nanoparti...

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Bibliographic Details
Published in:Polymer (Guilford) 2013-01, Vol.54 (1), p.127-133
Main Authors: Kovalev, Mikhail K., Kalinina, Fedosya, Androsov, Dmitry A., Cho, Chungkun
Format: Article
Language:English
Subjects:
Applied sciences
Composites
Exact sciences and technology
Forms of application and semi-finished materials
glass
glass transition temperature
manufacturing
Nanocomposites
nanoparticles
Optical films
optical properties
Polyimide-amides
Polymer industry, paints, wood
polymers
silica
Technology of polymers
thermal expansion
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Summary:Herein we report a method that improves the optical properties of polyimide-aramid (PIA) by the addition of a large quantity of silica. High silica loading was successful due to the good compatibility of synthesized unique silane end-capped polyimide-aramid (PIA) with in-situ formed silica nanoparticles. The prepared polymer films exhibited excellent optical properties, stability at 400 °C, a high decomposition and glass transition temperature, and a relatively low coefficient of thermal expansion (CTE) close to that of a glass substrate. These films may have potential applications in high-temperature (over 400 °C) electronic and optoelectronic manufacturing processes as a flexible transparent substrate. [Display omitted]
ISSN:0032-3861
1873-2291
DOI:10.1016/j.polymer.2012.11.051