Photopolymerization-based 4D-printing of shape-memory materials containing high-performance polymers

• Published in: Reactive & functional polymers 2024-09, Vol.202, p.106001, Article 106001
• Main Authors: Nikishina, Alena N., Kholkhoev, Bato Ch, Bardakova, Kseniia N., Matveev, Zakhar A., Kurdanova, Zhanna I., Shakhmurzova, Kamila T., Zhansitov, Azamat A., Khashirova, Svetlana Yu, Timashev, Peter S., Burdukovskii, Vitaliy F.
• Format: Article
• Language: English
• Subjects: LCD 3D/4D-printing; Photopolymerization; Polyetherimide; Polysulfone; Shape memory polymers
• ISSN: 1381-5148
• DOI: 10.1016/j.reactfunctpolym.2024.106001

High-performance aromatic heterochain polymers are engineering thermoplastics with exceptional mechanical and thermal properties that have attracted great interest in various areas ranging from aerospace to biomedicine. However, there have been a number of difficulties to 3D-print materials based on such polymers with new promising performance characteristics. Herein, a number of new photosensitive compositions (PSCs) based on high-performance polyetherimide (PEI) or polysulfone (PSU), reactive functional monomer (N,N-dimethylacrylamide) and oligomer (bisphenol A ethoxylate diacrylate) has been developed. It has been shown that the use of the developed PSCs allows the formation of 3D-structures with high printing resolution by LCD 3D-printing. Subsequent thermal post-curing of 3D-printed green-state samples at 250°С for 1 h led to the fabrication of materials with the highest tensile strength (up to 41.9 ± 3.1 MPa), glass transition temperature (141 °C) and thermal stability (above 350 °C). In addition, 3D-printed structures demonstrate high-temperature shape memory effect with shape fixity ratio > 99% and shape recovery ratio up to 97.1%. [Display omitted] •A composition based on PEI or PSU can be used for LCD 3D-printing.•The materials are characterized by a high tensile strength and thermal stability.•The 4D-printed structures possess a good shape memory performance at Trec = 171 °C.