Embedded BIPV module-level DC/DC converters: Classification of optimal ratings

• Published in: Renewable energy 2020-02, Vol.146, p.880-889
• Main Authors: Ravyts, Simon, Vecchia, Mauricio Dalla, Van den Broeck, Giel, Yordanov, Georgi H., Gonçalves, Juliana Emanuella, Moschner, Jens D., Saelens, Dirk, Driesen, Johan
• Format: Article
• Language: English
• Subjects: BIPV; Curtain wall; DC/DC converters; LVDC; Module-level converters
• ISSN: 0960-1481; 1879-0682
• DOI: 10.1016/j.renene.2019.07.018

Building-integrated photovoltaics (BIPV) is seen as a key technology to reduce the environmental impact and net power consumption of buildings. The integration of PV into building components, such as façade, window, roof or shading elements, leads to a distributed generation over the building envelope with a profound impact on the electrical installation. Designing the electrical system with string inverters and a possible wide variety of module sizes and technologies is a challenging task. To overcome this issue, Module-Level Converters (MLCs) can be used. A supplementary benefit is that the consequences of partial shading can strongly be reduced. This paper investigates whether the current generation of MLCs is suited for embedment in facade BIPV modules. The PV output is categorized and compared to the input parameters of the converters. Besides the discrepancy between the physical dimensions of the converters and the desired installation location, thermal and electrical measurements on a prototype BIPV curtain wall element reveal that daily energy losses can be as high as 50% due to thermal overload when used in a moderate climate such as Belgium. The paper concludes by discussing further standardization of BIPV module-level converters. •Evaluation of BIPV curtain wall elements using different PV technologies.•Evaluation of BIPV MLCs from electrical, thermal and dimensional point-of-view.•Thermal auto-shutdown can lead to daily energy losses of more than 50%.•Standardization and BIPV as a new market segment for MLCs is discussed.•Modules with high output voltage are most suited for frame-integration.