Study of copper thick film metallization on aluminum nitride

This paper is focused on the study of copper thick film metallization on AlN. The copper metallization was realized by Thick Printed Copper (TPC) technology. The copper films were printed with a new adhesion copper paste designed for both AlN and Al2O3 substrates. Scanning electron microscopy (SEM)...

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Bibliographic Details
Published in:Scripta materialia 2020-02, Vol.176, p.23-27
Main Authors: Hlina, Jiri, Reboun, Jan, Hamacek, Ales
Format: Article
Language:English
Subjects:
Ceramics
Copper
Electrical properties
Metallizations
Nitrides
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Summary:This paper is focused on the study of copper thick film metallization on AlN. The copper metallization was realized by Thick Printed Copper (TPC) technology. The copper films were printed with a new adhesion copper paste designed for both AlN and Al2O3 substrates. Scanning electron microscopy (SEM) and energy-dispersive X-ray spectroscopy (EDS) analyses on cross-sections have shown that the paste adhesion to AlN and Al2O3 is provided by different bonding mechanisms. The influence of different adhesion mechanisms on electrical and mechanical properties as well as the morphology of copper films on AlN and Al2O3 substrates are described in this paper. [Display omitted]
ISSN:1359-6462
1872-8456
DOI:10.1016/j.scriptamat.2019.09.029