DUV-LED packaging using high density TSV in silicon cavity and laser-glass-frit-bonded UV transmitting glass cap

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Bibliographic Details
Published in:Sensors and actuators. A. Physical. 2022-09, Vol.344, p.113700, Article 113700
Main Authors: Chiba, Hirofumi, Suzuki, Yukio, Yasuda, Yoshiaki, Gong, Tianjiao, Tanaka, Shuji
Format: Article
Language:English
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ISSN:0924-4247
DOI:10.1016/j.sna.2022.113700