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Properties of N-rich Silicon Nitride Film Deposited by Plasma-Enhanced Atomic Layer Deposition
•N-rich silicon nitride film with a wide range N/Si ratio by PEALD process.•Study the kinetics of the PEALD process for N-rich silicon nitride films.•The application of N-rich silicon nitride films as charge-trapping layer in MAONOS devices. An N-rich silicon nitride film, with a lower refractive in...
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Published in: | Solid-state electronics 2017-07, Vol.133, p.10-16 |
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Main Authors: | , , , , , , |
Format: | Article |
Language: | English |
Subjects: | |
Citations: | Items that this one cites Items that cite this one |
Online Access: | Get full text |
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Summary: | •N-rich silicon nitride film with a wide range N/Si ratio by PEALD process.•Study the kinetics of the PEALD process for N-rich silicon nitride films.•The application of N-rich silicon nitride films as charge-trapping layer in MAONOS devices.
An N-rich silicon nitride film, with a lower refractive index (RI) than the stoichiometric silicon nitride (RI=2.01), was deposited by alternating the exposure of dichlorosilane (DCS, SiH2Cl2) and that of ammonia (NH3) in a plasma-enhanced atomic layer deposition (PEALD) process. In this process, the plasma ammonia was easily decomposed to reactive radicals by RF power activating so that the N-rich silicon nitride was easily formed by excited ammonia radicals. The growth kinetics of N-rich silicon nitride were examined at various deposition temperatures ranging from 400°C to 630°C; the activation energy (Ea) decreased as the deposition temperature decreased below 550°C. N-rich silicon nitride film with a wide range of values of refractive index (RI) (RI=1.86–2.00) was obtained by regulating the deposition temperature. At the optimal deposition temperature, the effects of RF power, NH3 flow rate and NH3 flow time were on the characteristics of the N-rich silicon nitride film were evaluated. The results thus reveal that the properties of the N-rich silicon nitride film that was formed by under plasma-enhanced atomic layer deposition (PEALD) are dominated by deposition temperature. In charge trap flash (CTF) study, an N-rich silicon nitride film was applied to MAONOS device as a charge-trapping layer. The films exhibit excellent electron trapping ability and favor a fresh cell data retention performance as the deposition temperature decreased. |
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ISSN: | 0038-1101 1879-2405 |
DOI: | 10.1016/j.sse.2017.04.005 |