The influence of abrasive particle size in copper chemical mechanical planarization

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Bibliographic Details
Published in:Surface & coatings technology 2013-09, Vol.231, p.543-545
Main Authors: WEI, Kuo-Hsiu, WANG, Yu-Sheng, LIU, Chuan-Pu, CHEN, Kei-Wei, WANG, Ying-Lang, CHENG, Yi-Lung
Format: Article
Language:English
Subjects:
Cross-disciplinary physics: materials science
rheology
Exact sciences and technology
Materials science
Physics
Surface treatments
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ISSN:0257-8972
1879-3347
DOI:10.1016/j.surfcoat.2012.04.004